CIPS

When: March 10th, 2026 to March 12th, 2026
Location: Dresden, Germany

At the International Conference on Integrated Power Electronics Systems (CIPS), Vladimir Polezhaev will present the publication “Design, fabrication and testing of a novel 650V / 10 mΩ GaN embedded Half-bridge-in-Package (eHiP) with optimized thermal performance and low parasitics“, while Hauke Lutzen will present “From Insight into Bandwidth to Fast-Transient Precision: Diamond-M-Shunts for Wideband Current Measurement“.

For more information, please refer to: CIPS website